J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies (Includes Amendment 1)-Download

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User. IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610F and is supported by IPC-HDBK-001. Released April 2016. Note: J-STD-001F with Amendment 1 incorporates the requirements of J-STD-001F and J-STD-001F Amendment 1 into one document. Criteria are presented in a seamless J-STD-001 format, and there are no redline marks. IMPORTANT: Single-Device DRM-Protected DocumentThis document has single-device/user digital rights management (DRM) protection. This document will only be accessible by a single user on a single device. If you are purchasing this DRM-protected document for another user, you will need to provide contact information for that user when placing your order.