IPC-QRG-SMT-H Surface Mount Solder Joint Evaluation Training & Reference Guide - Download

Note: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User. Updated to Revision H of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. Useful as a training aid in the classroom or on the shop floor, QRG-SMT contains computer generated color illustrations of Chip component, Gull Wing, J Lead, BTC and Area Array solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths. QRG-SMT-H also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections. The appropriate specification/paragraph references from the IPC-A-610H are included for each of the acceptance criteria for further verification. IMPORTANT: Single-Device DRM-Protected DocumentThis document has single-device/user digital rights management (DRM) protection. This document will only be accessible by a single user on a single device. If you are purchasing this DRM-protected document for another user, you will need to provide contact information for that user when placing your order.